Stencil Evaluation

TopLine_2017

Stencil Evaluation Kit Stencil Evaluation Kit 104 QFP 256 .4mm QFP 208 .5mm TSOP32 .5mm QFP100 .65mm 0402 0603 PN935001 PLCC 44 MINI MELF D PAK SCREEN TEST PATTERN DAISY CHAIN T1+ T2+ T3+ T4+ T5+ T1- T2- T3- T4- T5- BGA225 1.5mm Pitch ™ Ph 1-714-898-3830 Fax 1-714-891-0321 © 1998 TopLine SOL 20 We supply the board and components. You provide the stencil. All kits include a ball grid array with daisy chain test and 0.4mm pitch QFP256. 1+ 2+ 3+ 4+ 5+ BGA225 After Mounting To Test Board FEATURES LPI Solder Mask FR4 Board .062” Double Sided Tooling Holes .125” Fiducial Marks Actual Size: 4” x 5.5” (100 x 140mm) 1- 2- 3- 4- 5- A R 1 15


TopLine_2017
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