NN-SOL: Non-Collapsible Elastomer Core Solder Ball - CCGA Pin: Column Grid Array Solder Column

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Non Collapsible Solder Ball Sn96.5Ag3.5 with Cu & Elastomer Core Dia C opper Solder P art D C ore C u S N umber 80um 60um 3um 7um NN2-SOL-80-3C7SA 110um 80um 5um 10um NN2-SOL-110-5C10SA 200um 150um 5um 20um NN2-SOL-200-5C20SA 200um 130um 5um 30um NN2-SOL-200-5C30SA 250um 150um 10um 40um NN2-SOL-250-10C40SA 262um 198um 7um 25um NN2-SOL-262-7C25SA 310um 210um 10um 40um NN2-SOL-310-10C40SA 311um 235um 8um 30um NN2-SOL-311-8C30SA 350um 264um 10um 33um NN2-SOL-350-10C33SA 500um 400um 15um 35um NN2-SOL-500-15C35SA 650um 550um 20um 30um NN2-SOL-650-20C30SA 910um 790um 20um 40um NN2-SOL-910-20C40SA 151 Plastic Core Ni Cu Ni Barrier Layer SnAg Solder Ni Dope CORE Cu S Solder D APPLICATIONS: DIMENSIONALLY STABLE. SOLDERABLE. DURABLE. USE TO SUPPORT & INTERCONNECT MODULES TO MOTHER BOARD. NON-COLLAPSIBLE TOP MOUNTED BGA/CSP (PoP) PACKAGE. SOLDERABLE SPACER/STANDOFF. FR4, GLASS, CERAMIC, BT CCGA SOLDER COLUMNS C olumn F igure Diameter L ength M aterials 1 0.020” 0.087” Pb90/Sn10 0.51mm 2.21mm 0.020” 0.087” 0.51mm 2.21mm 0.020” 0.100” 0.51mm 2.54mm 0.022” 0.087” 0.56mm 2.21mm 0.022” 0.100” 0.56mm 2.54mm 3 0.020” 0.050” Be Cu 0.51mm 1.27mm Micro-Coil Spring Pb80/Sn20 2 Cu Wrap Fig. 1 Pb90/Sn10 Plain Fig. 2 Pb80/Sn20 Cu Wrap *NASA Fig. 3 Be Cu Spring * Licensed from NASA under U.S. Patent Application Serial No. 13/800,692


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