M-QFN: Open Cavity QFN - Open Cavity QFN Air Cavity - M-QFN: Open (Air) Cavity QFN Package

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Open Cavity M-QFN Attach Your Die RoHS Pb-Free Open Tool Packages Visit www.MirrorSemi.com Ordering Information B ody D/E Nbr Lead Die Pad Cavity Package Tray Size SQ Leads P itch mm Part Number XH1 Qty 3mm 8 0.65mm 1.4 SQ M-QFN8W.65 100 3mm 12 0.5mm 1.4 SQ M-QFN12W.5 100 3mm 16 0.5mm 1.4 SQ M-QFN16W.5 100 4mm 16 0.65mm 2.4 SQ M-QFN16W.65 64 4mm 20 0.5mm 2.4 SQ M-QFN20W.5 64 4mm 24 0.5mm 2.4 SQ M-QFN24W.5 64 5mm 32 0.5mm 3.4 SQ M-QFN32W.5 36 5mm 40 0.4mm 3.4 SQ M-QFN40W.4 36 6mm 40 0.5mm 4.4 SQ M-QFN40W.5 25 6mm 48 0.4mm 4.4 SQ M-QFN48W.4 25 7mm 48 0.5mm 5.4 SQ M-QFN48W.5 81 8mm 56 0.5mm 6.0 SQ M-QFN56W.5 64 9mm 64 0.5mm 7.0 SQ M-QFN64W.5 49 10mm 72 0.5mm 8.0 SQ M-QFN72W.5 49 12mm 80 0.5mm 9.0 SQ M-QFN80W.5 36 12mm 100 0.4mm 9.0 SQ M-QFN100W.4 36 I N F O TOP VIEW SIDE VIEW 0.635 6° E Die Pad Open cavity. Attach and wire bond your own die. Wire bondable. Applications: MEMS, RF Microwave. Fabless prototype, Socket probing Visit www.MirrorSemi.com for drawings Cavity Bottom Attach die here D4 PITCH Pad L D W 0.840 0.175 TYP Die D E 0.175 Die Pad A A Pad BOTTOM VIEW 152


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