TD: Test (Si) Die for Practice - TD: Test (Si) Die for Practice

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Silicon Test Die For Bonding Practice Daisy Chain & Isolated RoHS Pb-Free Ordering Information Die P ad N br T ray P art F ig. C ircuit Size Size P ads Qty N umber Fig. 1 Daisy Chain 1.0x1.0mm 60x160μm 8 Pair 100 TD8-1.0-DC Fig. 2 Daisy Chain 2.5x2.5mm 60x160μm 16 Pair 100 TD16-2.5-DC Fig. 3 Daisy Chain 4.0x4.0mm 60x360μm 24 Pair 64 TD24-4.0-DC Fig. 4 Isolated 1.0x1.0mm 60μm SQ 16 100 TD16-1.0-ISO Fig. 5 Isolated 2.5x2.5mm 60μm SQ 32 100 TD32-2.5-ISO Fig. 6 Isolated 4.0x4.0mm 60μm SQ 48 64 TD48-4.0-ISO Fig. 7 Differential Pair 1.0x1.0mm 60x160μm 2 + GND 100 TD2-1.0-DIF Fig. 8 Differential Pair 2.5x2.5mm 60x160μm 2 + GND 100 TD2-2.5-DIF Fig. 9 Differential Pair 4.0x4.0mm 60x160μm 2 + GND 64 TD2-4.0-DIF Fig. 10 Fully Plated 1.0x1.0mm 900μm SQ 1 100 TD1-1.0-BUS Fig. 11 Fully Plated 2.5x2.5mm 2400μm SQ 1 100 TD1-2.5-BUS Fig. 12 Fully Plated 4.0x4.0mm 3900μm SQ 1 64 TD1-4.0-BUS I N F O Fig. 1 TD8-1.0DC Fig. 2 TD16-2.5-DC Die Material is Silicon (Si) 250um (10mil) thick. Metallization 1.0um Aluminum (Al) over 0.75μm SiO2 Wire bondable with Gold (Au) or Aluminum (Al) wire. Applications: Wire Bonding Practice or for RF / impedance characterization trials. Fig. 3 TD24-4.0-DC Not to Scale 156


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