Ball Devices - W: Silicon Wafers & Die

TopLine_2017

Mechanical Grade Dummy Wafer and Die Dummy Wafer Ordering Information Wafer Wafer in in Die W afer W afer Jar Casette Tape & Ring Diameter T ype P art Number Part Number Part Number Mirrored/Polished Wafer WM4-J WM4-C - 4-inch Wafer with Etched Pattern WE4- mm x mm - J WE4- mm x mm -C - (100mm) Wafer with Sawn Mirror Die - - WMD4- mm x mm -NTR Wafer with Sawn Etched Die - - WED4- mm x mm -NTR Mirrored/Polished Wafer WM5-J WM5-C - 5-inch Wafer with Etched Pattern WE5- mm x mm - J WE5- mm x mm -C - (125mm) Wafer with Sawn Mirror Die - - WMD5- mm x mm -NTR Wafer with Sawn Etched Die - - WED5- mm x mm -NTR Mirrored/Polished Wafer WM6-J WM6-C - 6-inch Wafer with Etched Pattern WE6- mm x mm - J WE6- mm x mm -C - (150mm) Wafer with Sawn Mirror Die - - WMD6- mm x mm -NTR Wafer with Sawn Etched Die - - WED6- mm x mm -NTR Mirrored/Polished Wafer WM8-J WM8-C - 8-inch Wafer with Etched Pattern WE8- mm x mm - J WE8- mm x mm -C - (200mm) Wafer with Sawn Mirror Die - - WMD8- mm x mm -NTR Wafer with Sawn Etched Die - - WED8- mm x mm -NTR Mirrored/Polished Wafer WM12-J WM12-C - 12-inch Wafer with Etched Pattern - WE12-mm x mm-C - (300mm) Wafer with Sawn Mirror Die - - WMD12- mm x mm -NTR Wafer with Sawn Etched Die - - WED12-mm x mm-NTR 18-inch Glass Wafer WM18-J CALL - (450mm) 33 Typical Wafer Thicknes Before Back Grinding Options Back Grinding: Add suffix -BG after wafer size in part number Blue Nitto Tape = NT suffix Blue Nitto Tape & Ring = NTR suffix Ultra Violet Tape & Ring = UVR suffix Die in 2” Waffle Pack: Add -WP2 to part number Etch Die: ED (sawn) Mirror Die = MD (sawn) 4” wafer = 525μm (20 mils) 5” wafer = 625μm (24 mils) 6” wafer = 680μm (27 mils) 8” wafer = 725μm (29 mils) 12” wafer = 775μm (31mils) 18” wafer = 925um (36mil)


TopLine_2017
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