FC: Flip Chip

TopLine_2017

Flip Chip Silicon Die Die per Waffle B umped Nbr Bump Information Die Size 5” Wafer Bumps P itch H igh Ø Dia M aterial M etric N otes Qty XI1 Qty 48 457μm 140 178μm Eutectic 6.3mm SQ PB18 236 FC48D6.3E457 25 88 204μm 107 102μm Eutectic 5.08mm SQ PB08 340 FC88G5.08E204 36 112 152μm 85 88μm Eutectic 5.08mm SQ PB06 340 FC112K5.08E152 36 317 254μm 119 102μm Eutectic 5.08mm SQ FA10 340 FC317G5.08E254 36 1268 254μm 119 102μm Eutectic 10.2mm SQ FA10 81-85 FC1268G10E254 49 2853 254μm 119 102μm Eutectic 15.0mm SQ FA10 28 FC2853G15E254 25 5072 254μm 119 102μm Eutectic 20.0mm SQ FA10 18 FC5072G20E254 9 I N F O Dummy Component Ordering Information part numbering system 34 RoHS Pb-Free FC 48 D 6.3 E 457 Flip Chip FC = Standard Flip Chip FCW = Bumped Wafer FCQ = Quartz Flip Chip FCWQ = Quartz Wafer FCN = Bumpless Chip FCWN = Bumpless Wafer Number Bumps Actual Count Bump Diameter A = 100 x 127μm B = 115μm SQ C = 160μm D = 190μm E = 56μm SQ Die Size In millimeter 6.3 = 6.3mm SQ 10 x 15 = 10mm x 15mm Bump Material E = Eutectic Sn63 G = Gold over Nickel C = Lead Free Sn/Ag/Cu A = Aluminum (Bumpless) Bump Pitch in μm (1000m = 1.0μm) H = 105μm SQ K = 88μm G = 100-135μm R = 100μm SQ T = 50μm SQ - DC Daisy Chain Eutectic 63/37 SnPb allows repeatable bump collapse of 25-40μm for a typical 125μm tall bump. Flip Chips are available with daisy chain (-DC). For bumped wafers, change prefix of part number to FCW. For bumpless flip chip for wire bonding, change suffix to FCN. Pb Lead Free available, change “E” to “C” in part number for Sn96.8/Ag2.6/Cu0.6 -SAC266 - Lead Free Eutectic Bumps.


TopLine_2017
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