WLP - CSP: 0.3mm Pitch

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N br B ody Ball B all F ig B alls Size Allignment M atrix Substrate XJ1 Qty Fig.1 Fig.2 Fig.3 Fig.4 10 9 8 7 5 4 3 2 14 13 12 11 10 9 8 7 6 5 4 3 2 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 12 11 10 WLP100T.3C-DC108D WLP144T.3C-DC127D WLP196T.3C-DC148D WLP256T.3C-DC168D 20 19 18 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 AF AE AD AC AB AA P N M L K J H G F E D C B A 26 25 24 23 22 21 20 19 18 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 30 29 28 26 25 24 23 22 21 20 19 18 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 WLP264T.3C-DC173D WLP400T.3C-DC208D WLP676T.3C-DC260D WLP900T.3C-DC307D I N F O Dummy Component Ordering Information 36 RoHS Pb-Free WLP - CSP Wafer Level Product 0.3mm Pitch - 4 0.6m Full 2x2 Si WLP4T.3C-DC022D CALL - 16 1.2mm Full 4x4 Si WLP16T.3C-DC048D CALL - 36 1.8mm Full 6x6 Si WLP36T.3C-DC067D CALL - 64 2.4mm Full 8x8 Si WLP64T.3C-DC088D CALL 1 100 3.0mm Full 10x10 Si WLP100T.3C-DC108D 256 2 144 3.6mm Ful 12x12 Si WLP144T.3C-DC127D 256 3 196 4.2mm Full 14x14 Si WLP196T.3C-DC148D 196 4 256 4.8mm Full 16x16 Si WLP256T.3C-DC168D 144 5 264 6.0mm 6-Row 17x17 Si WLP264T.3C-DC173D 121 6 400 6.0mm Full 26x26 Si WLP400T.3C-DC208D 121 7 676 7.8mm Full 26x26 Si WLP676T.3C-DC260D 64 8 900 9.0mm Full 30x30 Si WLP900T.3C-DC307D 49 - 1600 12mm Full 40x40 Si WLP1600T.3C-DC407D 36 WLP - Wafer Level CSP. Total package height 0.57mm. Ball diameter is 0.20mm. Silicon die with copper pillar design. Additional sizes are available. Tape & Reel change “T” to “E” Diced Wafer Tape on Ring = NTR P b - Lead Free - All items Pb-Free RoHS with SnAgCu balls. 4" Waffle Part Number 0.3mm 0.57mm 0.2mm Fig.5 Fig.6 Fig.7 Fig.8 P N M L K J H G F E D C B A 1 Y W V U T R 17 P N M L K J H G F E D C B A 1 Y W V U T R 17 1 Y W V U T R 17 AF AE AD AC AB AA 27 AK AJ AH AG U T R P N M L K J H G F E D C B A 1 K J H G F E D C B A 6 1 P N M L K J H G F E D C B A 1 P N M L K J H G F E D C B A 1 T R M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9


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