WLP - CSP: 0.4mm Pitch

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N br B ody Ball B all F ig B alls Size Allignment M atrix Substrate XJ1 Qty T R I N F O Dummy Component Ordering Information Fig.2 N M L K J H G F E D C B A 37 RoHS Pb-Free WLP - CSP Wafer Level Product 0.4mm Pitch - 4 0.8mm Full 2x2 Si WLP4T.4C-DC022D CALL - 16 1.6mm Full 4x4 Si WLP16T.4C-DC048D CALL - 36 2.4mm Full 6x6 Si WLP36T.4C-DC067D CALL - 64 3.2mm Full 8x8 Si WLP64T.4C-DC088D 256 1 100 4.0mm Full 10x10 Si WLP100T.4C-DC108D 196 2 144 6.0mm 4-Row 13x13 Si WLP144T.4C-DC133D 144 3 196 5.6mm Full 14x14 Si WLP196T.4C-DC148D 121 4 256 6.4mm Full 16x16 Si WLP256T.4C-DC168D 81 5 400 8.0mm Full 20x20 Si WLP400T.4C-DC208D 64 6 676 10.4mm Full 26x26 Si WLP676T.4C-DC260D 49 7 900 12mm Full 30x30 Si WLP900T.4C-DC307D 36 Fig.4 K J H G F E D C B A P N M L K J H G F E D C B A 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Fig.5 P N M L K J H G F E D C B A 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 10 9 8 7 6 5 4 3 2 1 Y W V U T R Fig.6 P N M L K J H G F E D C B A P N M L K J H G F E D C B A 13 12 11 10 9 8 7 6 5 4 3 2 1 Y W V U T R AF AE AD AC AB AA Fig.1 WLP - Wafer Level CSP. Total package height 0.61mm. Ball diameter is 0.25mm. Silicon die with copper pillar design. Additional sizes are available. Tape & Reel change “T” to “E” Diced Wafer Tape on Ring = NTR P b - Lead Free - All items Pb-Free RoHS with SnAgCu balls. 4" Waffle Part Number WLP256T.4C-DC168D WLP400T.4C-DC208D 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 WLP676T.4C-DC260D Fig.7 P N M L K J H G F E D C B A 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Y W V U T R 14 13 12 11 10 9 8 7 6 5 4 3 2 1 AF AE AD AC AB AA Fig.3 AK AJ AH AG WLP900T.4C-DC307D 0.4mm 0.61mm 0.25mm WLP100T.4C-DC108D WLP144T.4C-DC133 WLP196T.4C-DC148D


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