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N br B ody Ball B all F ig B alls Size Allignment M atrix Substrate XJ1 Qty I N F O Dummy Component Ordering Information 38 RoHS Pb-Free BGA - CSP Ball Grid Array 0.4mm Pitch 1 97 5mm Full 10x10 BT CSP97T.4C-DC107 624 2 360 10mm 5-Row 23x23 BT BGA360T.4C-DC235 250 3 400 10mm Full 20x20 BT BGA400T.4-DC209 240/250 4 625 12mm Full 25x25 BT BGA625T.4-DC259 189 5 900 15mm Full 30x30 BT BGA900T.4-DC309 126 6 1600 17mm Full 40x40 BT BGA1600T.4-DC409 90 7 2025 21mm Full 45x45 BT LBGA2025T.4-DC459 60 A B C D E FG HJ 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 BGA900T.4-DC309 A B C D E F G H J K L M N P R T U V W Y A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 40 39 38 37 36 35 34 33 BGA1600T.4-DC409 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AR AT AU AV AW AY BGA - FR4 and BT Substrate. Ball diameter is 0.25mm. For Internal Die, add suffix -D to end of part number Depopulatted “perimeter” rows are available. - Lead free option: Add “C” after pitch in part number for SnAgCu balls. 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 BGA400T.4-DC209 0.4mm 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 LBGA2025T.4-DC459 1.25mm A B D C H G F E K J L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN AP AQ AR AT AU AV AW AY BA BB BC BD Pb 0.25mm A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 BGA625T.4-DC259 BGA360T.4C-DC235 A BCDEFGHJKLMNPRTUVWY AA AB AC 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 CSP97T.4C-DC107 K 10 9 8 7 6 5 4 3 2 1


TopLine_2017
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