WLP - CSP: 0.5mm Pitch

TopLine_2017

N br B ody Ball B all F ig B alls Size Allignment M atrix Substrate XJ1 Qty T R P N M L K J H G F E D C B A I N F O Dummy Component Ordering Information Fig.1 Fig.2 Fig.3 Fig.4 H G F E D C B A 8 7 6 5 4 3 2 1 K J H G F E D C B A 10 9 8 7 6 5 4 3 2 1 M L K J H G F E D C B A 12 11 10 9 8 7 6 5 4 3 2 1 P N M L K J H G F E D C B A Fig.5 Fig.6 Fig.7 Fig.8 39 RoHS Pb-Free WLP - CSP Wafer Level Product 0.5mm Pitch - 4 1.0mm Full 2x2 Si WLP4T.5C-DC022D CALL - 16 2.0mm Full 4x4 Si WLP16T.5C-DC048D CALL - 36 3.0mm Ful 6x6 Si WLP36T.5C-DC067D 256 1 64 4.0mm Full 8x8 Si WLP64T.5C-DC088D 196 2 100 5.0mm Full 10x10 Si WLP100T.5C-DC108D 144 3 144 6.0mm Full 12x12 Si WLP144T.5C-DC127D 121 4 196 7.0mm Full 14x14 Si WLP196T.5C-DC148D 81 5 256 8.0mm Full 16x16 Si WLP256T.5C-DC168D 64 6 400 10mm Full 20x20 Si WLP400T.5C-DC208D 49 7 676 13mm Full 26x26 Si WLP676T.5C-DC260D 36 8 900 15mm Full 30x30 Si WLP900T.5C-DC307D 25 P N M L K J H G F E D C B A 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Y W V U T R AK AJ AH AG AF AE AD AC AB AA P N M L K J H G F E D C B A P N M L K J H G F E D C B A Y W V U T R WLP - Wafer Level CSP. Total package height 0.64mm. Ball diameter is 0.3mm. Silicon die with copper pillar design. Additional sizes are available. Tape & Reel change “T” to “E” Diced Wafer Tape on Ring = NTR P b - Lead Free - All items Pb-Free RoHS with SnAgCu balls. 4" Waffle Part Number 14 13 12 11 10 9 8 7 6 5 4 3 2 1 WLP64T.5C-DC088D WLP100T.5C-DC108D WLP144T.5C-DC127D WLP196T.5C-DC148D 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Y W V U T R AF AE AD AC AB AA WLP256T.5C-DC168D WLP400T.5C-DC208D WLP676T.5C-DC260D WLP900T.5C-DC307D 0.5mm 0.64mm 0.3mm


TopLine_2017
To see the actual publication please follow the link above