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N br B ody Ball B all F ig B alls Size Allignment H eight M atrix Substrate XJ1 Qty I N F O Dummy Component Ordering Information 40 RoHS Pb-Free CSP Ball Grid Array 0.5mm Pitch 1 6 1.5 x 1.0mm Full 0.65mm 3 x 2 Si CSP6E7A.5-DC023 Reel 2 40 5mm 2-Row 1.24mm 8 x 8 BT CSP40T.5-DC082 624 3 56 6mm 2-Row 1.24mm 10 x 10 BT CSP56T.5-DC102 608 4 84 6mm 3-Row 1.1mm 10 x 10 BT CSP84T.5-DC104 608 5 84 7mm 3-Row 1.1mm 12 x 12 BT CSP84T.5-DC123 476 6 96 8mm 2-Row 1.24mm 14 x 14 Pi fBGA96T.5-DC144 360 7 132 8mm 3-Row 1.1mm 14 x 14 BT CSP132T.5-DC145 360 8 228 12mm 3-Row 1.1mm 22 x 22 BT LBGA228T.5-DC222 189 9 288 12mm 4-Row 1.1mm 22 x 22 BT LBGA288T.5-DC221 189 10 484 12mm Full 1.1mm 22 x 22 BT LBGA484T.5-DC229 189 11 2025 25mm Full 1.8mm 45 x 45 BT LBGA2025T.5-DC459 44 - 625 15mm Full 1.3mm 25x25 BT BGA625T.5-DC259 126 - 676 15mm Full 1.3mm 26x26 BT BGA676T.5-DC269 126 - 900 17mm Full 1.3mm 30x30 BT BGA900T.5-DC309 90 - 1600 25mm Full 1.3mm 40x40 BT BGA1600T.5-DC409 60 0.5mm 1.25mm 0.30mm CSP - BT substrate. Total package height 1.25mm. Ball diameter is 0.3mm. For Internal Die, add suffix -D to end of part number Pb - Lead free option: Add “C” after pitch in part number for SnAgCu balls.


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