BGA: 0.65mm, 0.75mm, 0.8mm Pitch

TopLine_2017

BGA & CSP Ball Grid Array 0.65~0.8mm Pitch Dummy Component Ordering Information RoHS Pb-Free N br B ody Ball B all F ig B alls Size Pattern P itch M atrix Substrate XJ1 Qty 1A 46 6 x 7mm Full 0.75mm 6 x 8 BT BGA46T.75-DC24 160 1C 48 6 x 7mm Full 0.75mm 6 x 8 BT BGA48T.75-6x8 160 2 36 6mm Full 6 x 6 BT BGA36T.8-DC069 608 1B 48 8 x 9mm Full 6 x 8 FR4 LBGA48T.8-DC689 297 3 49 7mm Full 7 x 7 BT BGA49T.8-DC077 476 4 64 8mm Full 8 x 8 BT BGA64T.8-DC089 360 5 81 8mm Full 9 x 9 BT BGA81T.8-DC099 360 6 100 10mm Full 10 x 10 BT BGA100T.8-DC109 250 7 112 10mm 4-Row 0.8mm 11 x 11 FR4 LBGA112T.8-DC114 184 8 144 12mm Full 12 x 12 FR4 LBGA144T.8-DC128 189 9 144 12mm 4-Row 13 x 13 FR4 LBGA144T.8-DC134 168/198 10 208 15mm 4-Row 17 x 17 BT BGA208T.8-DC170 126 11 280 17mm 5-Row 19 x 19 FR4 LBGA280T.8-DC195 90 12 532 23mm 7-Row 26 x 26 FR4 LBGA532T.8-DC266 60 13 676 23mm Full 26 x 26 BT BGA676T.8-DC269 60 14 2025 40mm Full 45 x 45 BT LBGA2025T.8-DC459D 21 - 336 15mm 6-Row 0.65mm 20x20 FR4 BGA336T.65-DC203D 126 15 2025 32.5mm Full 0.65mm 45 x 45 BT LBGA2025T.65DC459D 24 42 BGA46T.75-DC24 I N F O fig. 1A A B C D E F G A B C D E F G H 6 5 4 3 2 1 BGA - Near CSP dimensions on rigid BT substrate with molding compound. Eutectic Sn63 solder balls 0.46mm diameter. (0.75mm Pitch is 0.3mm ball diameter) LBGA -FR4 features near CSP dimensions with unencapsulated body. Eutectic Sn63 solder balls 0.46mm diameter. P b -Lead free option: Add “C” after pitch in part number for SnAgCu balls. A B C D E F G H 6 5 4 3 2 1 fig. 1C fig. 1B BGA48T.75-6x8 H 6 5 4 3 2 1 LBGA48T.8-DC689 1.4mm Max BGA and LBGA 0.8 fig. 2 BGA36T.8-DC069 A B C D E F 6 5 4 3 2 1 Ball View


TopLine_2017
To see the actual publication please follow the link above