BGA: 1.27mm Pitch

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N br B ody B all C enter B all Fig B alls Size P attern B all M atrix XJ1 Standard Unencapsulated Qty I N F O BGA Plastic Ball Grid Array 1.27mm Pitch Dummy Component Ordering Information Side View BGA LBGA 1.27mm 46 RoHS Pb-Free 1 208 23mm 4-Row -0- 17 x 17 BGA208T1.27-DC170 - 60 2 217 23mm 4-Row 3 x 3 17 x 17 BGA217T1.27-DC172 - 60 3 256 27mm 4-Row -0- 20 x 20 BGA256T1.27-DC200 - 40 4 256 21mm Full -0- 16 x 16 - LBGA256T1.27-DC61 60 5 272 27mm 4-Row 4 x 4 20 x 20 BGA272T1.27-DC202 - 40 6 352 35mm 4-Row -0- 26 x 26 BGA352T1.27-DC70 - 24 7 357 25mm Full NA 19 x 19 - LBGA357T1.27-DC73 24 8 388 35mm 4-Row 6 x 6 26 x 26 BGA388T1.27-DC72 - 24 9 1225 45mm Full -0- 35 x 35 - LBGA1225T1.27-DC359 12 2.1~2.3mm (ref) 1.27mm 2.1mm Max Molded Top Laminate Laminate BGA - Standard BGA plastic packages should be baked at 125˚C for 24 hours prior to assembly to prevent delamination and the “popcorn” phenomena during the assembly process. Solder balls are eutetic Sn63/Pb37 30mil (0.75mm) LBGA - Laminate Ball Grid Arrays offer the lowest cost when placement practice is the primary concern. Includes daisy chain laminate with 30mil (0.75mm) Sn63/Pb37 balls for soldering at 210˚C. Pb - Lead Free available. SnAgCu = Add “C” after pitch in part number.


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