CBGA: Ceramic 1.27mm Pitch

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N br B all B all Low Temp 210˚C High Temp 320˚C F ig B alls B ody Size P attern Matrix XJ1 62/36/2 SnPbAg XJ1 10/90 SnPb Qty 1 121 15mm Full Grid 11 x 11 CBGA121T1.27L-DC5 CBGA121T1.27-DC5 126 2 196 18.5mm Full Grid 14 x 14 CBGA196T1.27L-DC11 CBGA196T1.27-DC11 84 3 256 21mm Full Grid 16 x 16 CBGA256T1.27L-DC61 CBGA256T1.27-DC61 60 4 304 21 x 25mm Full Grid 16 x 19 CBGA304T1.27L-DC63 CBGA304T1.27-DC63 55 5 361 25mm Full Grid 19 x 19 CBGA361T1.27L-DC71 CBGA361T1.27-DC71 44 6 400 27mm Full Grid 20 x 20 CBGA400T1.27L-DC21 CBGA400T1.27-DC21 40 7 625 32.5mm Full Grid 25 x 25 - CBGA625T1.27-DC81 24 8 1089 42.5mm Full Grid 33 x 33 - CBGA1089T1.27-DC339 12 I N F O Dummy Component Ordering Information Fig. 1 Fig. 2 48 RoHS Pb-Free CBGA Ceramic Ball Grid Array 1.27mm Pitch A B C D E F G H J K L M N 14 1312 11 10 9 8 7 6 5 4 3 2 1 P CBGA196T1.27-DC11 (Ball View) 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L CBGA121T1.27-DC5 (Ball View) 1.7mm max height Ceramic Ball Grid Arrays are not sensitive to moisture and do not require baking prior to assembly. Ball diameter is 30 mils (0.75mm). Standard ball material is Sn10/Pb90 for high temperature soldering at 320˚C to ceramic substrate. For low temperature soldering at 210˚C to laminate substrate, specify Sn62/Pb36/Ag2 solder balls by adding -L to part number. Caution advised CTE mismatch > 25mm. P b Lead free available with SnAgCu balls. Add“C” after pitch in part number


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