BGA: 1.5mm Pitch

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I N F O BGA Plastic Ball Grid Array 1.5mm Pitch Dummy Component Ordering Information Side View BGA 51 RoHS Pb-Free N br B ody B all B all F ig B alls Size P attern M atrix XJ1 Qty 1 169 23mm Full Array 13 x 13 BGA169T1.5-DC10 60 2 225 27mm Full Array 15 x 15 BGA225T1.5-DC15 40 BGA Daisy Chain Patterns (Ball View) - Illustrations Not To Scale 1 A B C D E F G H J K L M N 13 Fig. 1 BGA169T1.5-DC10 Fig. 2 15 1 2.1~2.3mm (ref) 1.5mm B C D E F G H J K L M P BGA - Standard BGA plastic packages should be baked at 125˚C for 24 hours prior to assembly to prevent delamination and the “popcorn” phenomena during the assembly process. Solder balls are eutetic 63/37 SnPb 30mil (0.75mm) Pb - Lead Free Available: Add “C” after pitch in part number for SnAgCu balls. BGA225T1.5-DC15 A N R


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