eWLP: Embedded CSP Cu Post

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(H) N br Die (P) P ad P ad Die F ig P ads Size P itch M atrix Diameter T hicknes XJ1 Qty I N F O eWLP EMBEDED CSP DIE 0.3 ~ 0.4mm PITCH Dummy Component Ordering Information Fig. 4 Fig. 7 53 RoHS Pb-Free 1 2 3 4 5 6 7 1 2 3 4 5 6 7 4 16 36 64 100 144 196 4 16 36 64 100 144 196 0.56mm 1.16mm 1.76mm 2.36mm 2.96mm 3.56mm 4.16mm 0.76mm 1.56mm 2.36mm 3.16mm 3.96mm 4.76mm 5.56mm 0.3mm 0.4mm 2x2 4x4 6x6 8x8 10x10 12x12 14x14 2x2 4x4 6x6 8x8 10x10 12x12 14x14 0.15mm 0.20mm 200um and 360um 200um and 360um eWLP4T.3-DC022 eWLP16T.3-DC048 eWLP36T.3-DC067 eWLP64T.3-DC088 eWLP100T.3-DC108 eWLP144T.3-DC127 eWLP196T.3-DC148 eWLP4T.4-DC022 eWLP16T.4-DC048 eWLP36T.4-DC067 eWLP64T.4-DC088 eWLP100T.4-DC108 eWLP144T.4-DC127 eWLP196T.4-DC148 eWLP - New generation of thin CSP silicon die with copper (Cu) posts without surface treatment. Application is embedding die inside PC boards. Die thickness: 200um or 360um. Available die face up and face down. Packaging available: Waffle Pack, T&R and Wafer on UV Tape and Ring. 400 400 225 100 100 100 49 625 100 100 100 49 64 36 Fig. 1 eWLP4 Fig. 2 eWLP16 Fig. 3 eWLP36 Fig. 5 eWLP100 Fig. 6 eWLP144 eWLP196 eWLP64 F E D C B A 6 5 4 3 2 1 P N M L K J H G F E D C B A 14 13 12 11 10 9 8 7 6 5 4 3 2 1 B A 2 1 D C B A 4 3 2 1 M L K J H G F E D C B A 12 11 10 9 8 7 6 5 4 3 2 1 K J H G F E D C B A 10 9 8 7 6 5 4 3 2 1 F E D C B A 6 5 4 3 2 1 H P Pi Si Cut Away View Epoxy


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