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Open Cavity M-QFN Attach Your Die RoHS Pb-Free See details pages 152-155 Ordering Information Body Nbr Lead Die Pad Size Lid Cover Size SQ Leads P itch mm Part Number Part Nbr (optional) Open Cavity 3mm 8 0.65mm 1.4 SQ M-QFN8W.65 B-LID3-BLACK 3mm 12 0.5mm 1.4 SQ M-QFN12W.5 B-LID3-BLACK 3mm 16 0.5mm 1.4 SQ M-QFN12W.5 B-LID3-BLACK 4mm 16 0.65mm 2.4 SQ M-QFN16W.65 B-LID4-BLACK 4mm 20 0.5mm 2.4 SQ M-QFN20W.5 B-LID4-BLACK 4mm 24 0.5mm 2.4 SQ M-QFN24W.5 B-LID4-BLACK 5mm 28 0.5mm 3.4 SQ M-QFN28W.5 B-LID5-BLACK 5mm 32 0.5mm 3.4 SQ M-QFN32W.5 B-LID5-BLACK 5mm 40 0.4mm 3.4 SQ M-QFN40W.4 B-LID5-BLACK 6mm 40 0.5mm 4.4 SQ M-QFN40W.5 B-LID6-BLACK 6mm 48 0.4mm 4.4 SQ M-QFN48W.4 B-LID6-BLACK 7mm 48 0.5mm 5.4 SQ M-QFN48W.5 B-LID7-BLACK 8mm 56 0.5mm 6.4 SQ M-QFN56W.5 B-LID8-BLACK 10mm 72 0.5mm 8.4 SQ M-QFN72W.5 B-LID10-BLACK 12mm 80 0.5mm 10.4 SQ M-QFN80W.5 B-LID12-BLACK TOP VIEW SIDE VIEW 0.635 6° E Die Pad 56 I N F O Open cavity. Attach and wire bond your own die. Wire bondable. Applications: MEMS, RF Microwave. Fabless prototype, Socket probing Visit www.MirrorSemi.com for drawings Cavity Bottom Attach die here D4 PITCH Pad L D W 0.840 0.175 TYP Die D E 0.175 Die Pad A A Pad BOTTOM VIEW


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