Ball & Bump Kits - Flip Chip Kit

TopLine_2017

Flip Chip Kits 70 Laminate FR4 board for placement and daisy chain continuity testing after assembly. Each board has coupon sites for mounting 10 flip chips. Laminate board features multifunctional high temperature FR4 board (Tg = 170˚C) Plating Options: Ni-Au Standard Cu-OSP Available Board Thickness: .031” - 0.78mm FC317 .062” - 1.57mm FC48~FC220 Actual Size: 3.25” x 5.5” (83 x 140mm) Note Gerber Data is only available for laminate boards. FLIP CHIP KIT © 1998 TopLine Tel:1-714-898-3830 • Fax: 1-714-891-0321


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