BGA169/225

TopLine_2017

Ball Grid Array 88 PN967001 ™ T1+ T2+ T3+ T4+ T5+ T1- T2- T3- T4- T5- BGA225 1.5mm Pitch T1+ T2+ T3+ T4+ T5+ T1- T2- T3- T4- T5- BGA225 1.5mm Pitch BGA169 1.5mm Pitch BGA169 1.5mm Pitch T1+ T1- T2+ T3+ T4+ T5+ T6+ T7+ T2- T3- T4- T5- T6- T7- T1+ T1- T2+ T3+ T4+ T5+ T6+ T7+ T2- T3- T4- T5- T6- T7- 1 1 1 1 1 Ph 1-714-898-3830 Fax 1-714-891-0321 © 1998 TopLine TopLine makes practicing with Ball Grid Array technology accessible and affordable. Each board supports four BGAs with 1.5mm grid pattern and daisy chain test points to verify proper placement. Double sided board incorporates “two front side” design so only one solder paste stencil is needed. BGA169 & BGA225 with Daisy Chain Test 1.5mm Pitch Actual Size 4” x 5.5 (100 x 140mm) Features LPI Solder Mask FR4 Board .062” Double Sided Tooling Holes .125” Fiducial Marks


TopLine_2017
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