Universal BGA 1.27/1.5mm pitch

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90 TopLine’s Universal BGA Kits are economical. Includes non-daisychain BGA components. Kit has 1.27mm and 1.5mm pitch for placement and solder practice. Universal BGA Kit 1.27mm & 1.5mm Pitch Features LPI Solder Mask FR4 Board .062” Double Sided Tooling Holes A B C D E F G H J K L M A B C D E F G H J K L M A B C D E F G H J K L M A B C D E F G H J K L M Actual Size: 4” x 5.5” (100 x 140mm) Pad Geometries Pad Ball Dia. Dia. Pitch 23mil 30mil 1.5 mm 23mil 30mil 1.27mm Top Side- Soldermask defined pads Bottom Side- Etched defined pads TM BGA Universal Placement Soldermask Defined Pads www.TopLineDummy.com ©1999 TopLine PN946001T Rev A 1.27mm Pitch 1.5mm Pitch A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF 26 25 24 23 22 21 20 19 18 17 16 15 14 1312 11 10 9 8 7 6 5 4 3 2 1 N P R T U V W Y AA AB AC AD AE AF 26 25 24 23 22 21 20 19 18 17 16 15 14 1312 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF 26 25 24 23 22 21 20 19 18 17 16 15 14 1312 11 10 9 8 7 6 5 4 3 2 1 N P R T U V W Y AA AB AC AD AE AF 26 25 24 23 22 21 20 19 18 17 16 15 14 1312 11 10 9 8 7 6 5 4 3 2 1 N P R 15 14 1312 11 10 9 8 7 6 5 4 3 2 1 N P R 15 14 1312 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P R 15 14 1312 11 10 9 8 7 6 5 4 3 2 1


TopLine_2017
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